Miniwave soldering

Miniwave soldering

There are still PCBs with SMD parts and wired components which need to be soldered..  Selective soldering with miniwave offers itself especially for large quantities of solder joints. Miniwave can be used from a free space of 2mm around the solder area.  Owing to quick changeable nozzle sets this process is flexible and can be applicable for varied solder joints. Also tin coating of copper strands, as well as skinning of lacquered wires is also possible in miniwave.
Selective soldering derives from wave soldering with which the solder area is restricted due to reduction of the solder wave and reducing the soldering bath size to smaller solder nozzles.

Principally, it can be differentiated between “dragging” and “dipping” the work piece in liquid solder.
Dipping means that the work piece is dipped in a “stationary” miniwave.  In order that the emerging oxide film breaks away at the surface, the solder wave runs inside of the nozzle.  In order to reduce oxide formation on the nozzle orifice and to improve the soldering, the nozzle is bathed with nitrogen.

Selective soldering systems can be constructed as fully automated machinery in “in-line-models” or as hand assembly workplaces.  Basis is the Wolf Standard Module (see separate production information Production Module)

We offer our support with the process development and offer the possibility of soldering and preproduction series tests in our Technology Centre.

Process Workflow